Copper Conductive Paste

  

Low temperature curable copper paste with high screen printability and processability under air realizes highly conductive traces with good adhesion strength on various substrates.
Adaptive to various usages where silver pastes are used to date

FEATURES

 

Curable at lower temp. in air
 
(≥ 120 oC)

 

Good adhesion to various substrates
 
(Glass, PET, PI, FR4, ITO etc.)

 

High Conductivity
 
(Volume resistance: 20-30μΩ・cm)


Fine Line Available
 
(50 μm width)
 
GENERAL CHARACTERISTICS
Volume Resistivity μΩ・cm 20~30  
Adhesion Strength Cross-Cut 100/100  
Pencil Hardness   2H  
Durability Humidity Resistance 65℃,95%,1000hr below 5%  
Thermal Rsistance 128℃,240hr below 5%  
-40℃,1000hr below 5%  


SCREEN PRINTING EXAMPLES
 

Micrographs of a pattern after 150 times repetitive printing.

Equipment: CUBE1515 (Mino Group Co., Ltd.)

Resolution: L/S = 50/50 (μm)

 

DURABILITY
 
TEST ITEMS TEST CONDITIONS RESULTS
Humidity resitance 65 °C×95 %rh×1,000 h Volume resistivity change: <5 %.
No peeling-off observed.
Thermal resistance 70 °C×1,000 h
128 °C×240 h
-40 °C×1,000 h
Heat cycle test 80 °C, 1 h⇔-30 °C, 1 h
100 cycles
Migration resistance 85 °C×85 %rh×DC50 V
1,000 h (L/S = 318/318 μm)
No short circuit observed

Resistivity Change under Humidity Resistance Test (65 X 95%rh)